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Storage Server MP SuperServer DY-U-56
13 780 EUR
Current server configuration:
1x CSE-126ES2: X13DSF-A
2x 4410T 2P 10C2.7G150W(8/2.2/125,6/2.7/125)26.25M BI(1000) 7yr
4x 16GB DDR5-4800 1Rx8 LP (16Gb) ECC REG DIMM, HF, RoHS
6x Micron 7450 PRO 960GB NVMe PCIe 4x4 EDSFF E1.S TCG OPAL
1x Micron 5400 BOOT 240GB, SATA, M.2, 22x80mm, 3D TLC, 1DWP
1x AIOM 4port GbE SFP,Intel i350-AM4 with 0.5U bracket,RoHS
2x SOCKET E E1B CARRIER LGA 4677 W/SHIM SP MCC , DG1.0 ,
RoHS
General Description
Motherboard Super X13DSF-A Processor CPU Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
NoteSupports 145W - 270W TDP CPUs (Air Cooled)
System Memory Memory Slot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
Memory Voltage1.1V
On-Board Devices Chipset Intel® C741
Network connectivity via AIOM
NVMeView NVMe Options
Input / Output LAN1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB2 USB 3.0 port(s) (rear)
2 USB 3.0 port(s) (front)
Video1 VGA port(s)
System BIOSBIOS TypeAMI 32MB SPI Flash EEPROM
Management Software Super Cloud Composer
Server Manager (SSM)
Update Manager (SUM)
SuperDoctor® 5
Super Diagnostics Offline
Power configurations
Power-on mode for AC power recovery
ACPI Power Management
Security Hardware Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring CPU Monitors for CPU Cores, Chipset Voltages, Memory
7 Phase-switching voltage regulator
FANFans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
ChassisForm Factor1U Rackmount
Dimensions and WeightHeight1.7" (43.6 mm)
Width 17.2" (438.4 mm)
Depth 30.4" (773.25 mm)
Package 7.87" (H) x 23.81" (W) x 40.55" (D)
Weight Gross Weight: 68.74 lbs (31.2 kg)
Net Weight: 48 lbs (21.8 kg)
Available ColorSilver
Front PanelLEDNetwork activity
Power status
SSD activity
System information (overheat/UID)
Buttons Power On/Off
Expansion Slots PCI-Express (PCIe) ConfigurationDefault
2 PCIe 5.0 x16 FHFL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Drive Bays / Storage Drive Bays Configuration Default: Total 24 bay(s)
24 front hot-swap E1.S NVMe drive bay(s)
M.22 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
System Cooling Fans 8 Heavy Duty 4cm Fan(s)
Power Supply 2000W Redundant Titanium Level power supplies Dimension (WxHxL)73.5 x 40 x 203 mm
+12VMax: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)
12V SBMax: 3.5A
AC Input 1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vac / 50-60Hz
2000W: 230-240Vdc / 50-60Hz (for China only)
Output TypeBackplanes (gold finger)
Operating Environment ROHS RoHS Compliant
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (Non-Condensing)
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
Environmental / Recycling Recycle Return Server-End of Life Product
1x CSE-126ES2: X13DSF-A
2x 4410T 2P 10C2.7G150W(8/2.2/125,6/2.7/125)26.25M BI(1000) 7yr
4x 16GB DDR5-4800 1Rx8 LP (16Gb) ECC REG DIMM, HF, RoHS
6x Micron 7450 PRO 960GB NVMe PCIe 4x4 EDSFF E1.S TCG OPAL
1x Micron 5400 BOOT 240GB, SATA, M.2, 22x80mm, 3D TLC, 1DWP
1x AIOM 4port GbE SFP,Intel i350-AM4 with 0.5U bracket,RoHS
2x SOCKET E E1B CARRIER LGA 4677 W/SHIM SP MCC , DG1.0 ,
RoHS
General Description
Motherboard Super X13DSF-A Processor CPU Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
NoteSupports 145W - 270W TDP CPUs (Air Cooled)
System Memory Memory Slot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
Memory Voltage1.1V
On-Board Devices Chipset Intel® C741
Network connectivity via AIOM
NVMeView NVMe Options
Input / Output LAN1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB2 USB 3.0 port(s) (rear)
2 USB 3.0 port(s) (front)
Video1 VGA port(s)
System BIOSBIOS TypeAMI 32MB SPI Flash EEPROM
Management Software Super Cloud Composer
Server Manager (SSM)
Update Manager (SUM)
SuperDoctor® 5
Super Diagnostics Offline
Power configurations
Power-on mode for AC power recovery
ACPI Power Management
Security Hardware Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring CPU Monitors for CPU Cores, Chipset Voltages, Memory
7 Phase-switching voltage regulator
FANFans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
ChassisForm Factor1U Rackmount
Dimensions and WeightHeight1.7" (43.6 mm)
Width 17.2" (438.4 mm)
Depth 30.4" (773.25 mm)
Package 7.87" (H) x 23.81" (W) x 40.55" (D)
Weight Gross Weight: 68.74 lbs (31.2 kg)
Net Weight: 48 lbs (21.8 kg)
Available ColorSilver
Front PanelLEDNetwork activity
Power status
SSD activity
System information (overheat/UID)
Buttons Power On/Off
Expansion Slots PCI-Express (PCIe) ConfigurationDefault
2 PCIe 5.0 x16 FHFL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Drive Bays / Storage Drive Bays Configuration Default: Total 24 bay(s)
24 front hot-swap E1.S NVMe drive bay(s)
M.22 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
System Cooling Fans 8 Heavy Duty 4cm Fan(s)
Power Supply 2000W Redundant Titanium Level power supplies Dimension (WxHxL)73.5 x 40 x 203 mm
+12VMax: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)
12V SBMax: 3.5A
AC Input 1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vac / 50-60Hz
2000W: 230-240Vdc / 50-60Hz (for China only)
Output TypeBackplanes (gold finger)
Operating Environment ROHS RoHS Compliant
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (Non-Condensing)
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
Environmental / Recycling Recycle Return Server-End of Life Product
Applications Server - Hyper SuperServer RTU-56-70
11 430 EUR
Current server configuration:
1x Hyper 1U, 8x2.5", X13DEM,
2x EMR 4514Y 2P 16C2.0G150W(12/2.1,8/2.6/135)30M SGX6
2x 64GB DDR5-4800 2RX4 (16Gb) RDIMM
6x SSD 2.5" NVMe PCIe4 960GB 1DWPD TLC D, SED/TCG 7mm
1x AIOM Dual-Port 1GbE RJ45,based on i350-AM2 with 0.5U Bra
1x AOM-TPM-9672V-FIPS TPM 2.0 with 10 pins SPI support FIPS
1x AOC-VROCPREMOD
2x SOCKET E E1B CARRIER LGA 4677 W/SHIM SP MCC , DG1.0 ,
RoHS
1x 8 NVME cable kit for SYS-121H-TNR,RoHS
General Description
1x Hyper 1U, 8x2.5", X13DEM,
2x EMR 4514Y 2P 16C2.0G150W(12/2.1,8/2.6/135)30M SGX6
2x 64GB DDR5-4800 2RX4 (16Gb) RDIMM
6x SSD 2.5" NVMe PCIe4 960GB 1DWPD TLC D, SED/TCG 7mm
1x AIOM Dual-Port 1GbE RJ45,based on i350-AM2 with 0.5U Bra
1x AOM-TPM-9672V-FIPS TPM 2.0 with 10 pins SPI support FIPS
1x AOC-VROCPREMOD
2x SOCKET E E1B CARRIER LGA 4677 W/SHIM SP MCC , DG1.0 ,
RoHS
1x 8 NVME cable kit for SYS-121H-TNR,RoHS
General Description
- Product SKUs SuperServer SYS-121H-TNRMotherboard Super X13DEM Processor CPUDual Socket E (LGA-4677)
- 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
- Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
- Core CountUp to 64C/128T; Up to 320MB Cache per CPU
- NoteSupports up to 350W TDP CPUs (Air Cooled)*
- Supports up to 350W TDP CPUs (Liquid Cooled)
- *Air-cooled CPUs with TDP over 250W are only supported under specific conditions.
- GPU Max GPU CountUp to 1 double-width or 3 single-width GPU(s)
- Supported GPUNVIDIA PCIe: H100, RTX A5000, RTX A4000, L40S, L4
- CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
- GPU-GPU InterconnectPCIe
- System Memory MemorySlot Count: 32 DIMM slots
- Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
- Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
- Memory Voltage1.1V
- On-Board Devices SATASATA (6Gbps) ; RAID 0/1/5/10 support
- NVMeNVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
- ChipsetIntel® C741
- Network connectivity via AIOM
- Input / Output LAN1 RJ45 1 GbE Dedicated BMC LAN port(s)
- USB2 USB 2.0 port(s) (rear)
- 1 USB 3.0 port(s) (front)
- Video1 VGA port(s)
- System BIOSBIOS TypeAMI 256MB SPI Flash
- ManagementSoftware SuperCloud Composer
- Server Manager (SSM)
- Update Manager (SUM)
- SuperDoctor® 5
- Super Diagnostics Offline
- Power configurationsPower-on mode for AC power recovery
- ACPI Power Management
- SecurityHardwareTrusted Platform Module (TPM) 2.0
- Silicon Root of Trust (RoT) – NIST 800-193 Compliant
- FeaturesCryptographically Signed Firmware
- Secure Boot
- Secure Firmware Updates
- Automatic Firmware Recovery
- Supply Chain Security: Remote Attestation
- Runtime BMC Protections
- System Lockdown
- PC Health MonitoringCPUMonitors for CPU Cores, Chipset Voltages, Memory
- FANFans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
- TemperatureMonitoring for CPU and chassis environment
- Thermal Control for fan connectors
- ChassisForm Factor1U Rackmount
- ModelCSE-HS119-R1K24P2
- Dimensions and WeightHeight1.7" (43 mm)
- Width17.2" (437 mm)
- Depth29.4" (747 mm)
- Package8.1" (H) x 23.8" (W) x 40.6" (D)
- WeightGross Weight: 49 lbs (22.2 kg)
- Net Weight: 34 lbs (15.4 kg)
- Available ColorN/A
- Front PanelLEDHDD activity
- LAN1 activity
- Power
- System information
- ButtonsPower On/Off
- UID button
- Expansion Slots PCI-Express (PCIe) ConfigurationDefault
- 1 PCIe 5.0 x16 FHHL slot(s)
- 2 PCIe 5.0 x16 FH/10.5"L slot(s)
- 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
- M.22 M.2 NVMe/SATA slot(s) (B+M-key 2280/22110)
- Drive Bays / Storage Drive Bays ConfigurationDefault: Total 8 bay(s)
- 8 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
- Option A: Total 12 bay(s)
- 12 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
- (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
- M.22 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
- System CoolingFans8 counter-rotating 40x40x56mm Fan(s)
- Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
- Power Supply2x 1200W Redundant Titanium Level Hot-plug power suppliesDimension (WxHxL)73.5 x 40 x 265 mm
- +12VMax: 66.7A / Min: 0A (100Vac-127Vac)
- Max: 100A / Min: 0A (200Vac-240Vac)
- Max: 100A / Min: 0A (230Vdc-240Vdc) (for CCC only)
- 12V SBMax: 2.1A / Min: 0A
- AC Input800W: 100-127Vac / 50-60Hz
- 1200W: 200-240Vac / 50-60Hz
- 1200W: 230-240Vdc / 50-60Hz (for CCC only)
- Output TypeBackplanes (gold finger)
- Operating EnvironmentEnvironmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
- Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
- Operating Relative Humidity: 8% to 90% (non-condensing)
- Non-operating Relative Humidity: 5% to 95% (non-condensing)
- Environmental / RecyclingRecycle Return Server-End of Life Product
2U AI Inference and Machine Learning Server Hyper GF-RT-060
32 908 EUR
Current server configuration:
1x Hyper 2U, 12x3.5", X13DEM
2x 6530 2P 32C 2.1G 160MB 270W SGX128 (1xDSA) 7yr A1 4677 XCC
2x 64GB DDR5-5600 2Rx4 (10x4) (16Gb) LP ECC RDIMM
4x PM9A3 1.9TB NVMe PCIe 4x4 2.5" 7mm (1DWPD) SED
1x AIOM Dual-Port 1GbE RJ45,based on i350-AM2 with 0.5U Bra
1x NVIDIA Ada L40S 48GB GDDR6 PCIe Gen 4th-- 350w
1x AOM-TPM-9672V-FIPS TPM 2.0 with 10 pins SPI support FIPS
2x SOCKET E LGA4677, E1A XCC CARRIER, DG 1.0
1x 12VHPWR 2x6+4S to 2x4,MicroHi,26cm,6.25A/p,16AWG,RoHS
2x PWS-2K07A-1R
2x 1U Passive CPU VC HS for X13 Intel Eagle Stream Platform
1x HS219/HS829 GPU Plastic Air Shroud (CPU1) for X12DHM/X13DEM
1x HS219/HS829 GPU Plastic Air Shroud (CPU2) for X12DHM/X13DEM
1x GENZ 4C STR to 2 MCIO) x8 RA/RA 27/16cm,30#, RoHS
1x 12 NVME cable kit for SYS-621H-TN12R,RoHS
2x MCIOx8 (STR to RA),26cm,LNRV,30AWG,RoHS
2x PCIe
1x [NR](2x4 to 3 2x2), PH3.0,45cm,8.5A/p,18AWG,RoHS
4x 80x80x38 mm, 16.8K RPM, Middle Cooling Fan for 2U Hyper-S Se
1x Middle riser support bracket for CSE-HS219/HS29
2x Riser Bracket(2-slot) for RSC-H-68G5 for HE211/HS829/HS219,R
1x Riser Bracket(4-slot) for RSC-H2-6888G5L in CSE-HS219/HS829
3x 1U LHS Hyper Riser card with one PCI-E 5.0 X16 and one P
1x 1U LHS Hyper riser card with one PCI-E 5.0 X16 slot,HF,R
General Description
1x Hyper 2U, 12x3.5", X13DEM
2x 6530 2P 32C 2.1G 160MB 270W SGX128 (1xDSA) 7yr A1 4677 XCC
2x 64GB DDR5-5600 2Rx4 (10x4) (16Gb) LP ECC RDIMM
4x PM9A3 1.9TB NVMe PCIe 4x4 2.5" 7mm (1DWPD) SED
1x AIOM Dual-Port 1GbE RJ45,based on i350-AM2 with 0.5U Bra
1x NVIDIA Ada L40S 48GB GDDR6 PCIe Gen 4th-- 350w
1x AOM-TPM-9672V-FIPS TPM 2.0 with 10 pins SPI support FIPS
2x SOCKET E LGA4677, E1A XCC CARRIER, DG 1.0
1x 12VHPWR 2x6+4S to 2x4,MicroHi,26cm,6.25A/p,16AWG,RoHS
2x PWS-2K07A-1R
2x 1U Passive CPU VC HS for X13 Intel Eagle Stream Platform
1x HS219/HS829 GPU Plastic Air Shroud (CPU1) for X12DHM/X13DEM
1x HS219/HS829 GPU Plastic Air Shroud (CPU2) for X12DHM/X13DEM
1x GENZ 4C STR to 2 MCIO) x8 RA/RA 27/16cm,30#, RoHS
1x 12 NVME cable kit for SYS-621H-TN12R,RoHS
2x MCIOx8 (STR to RA),26cm,LNRV,30AWG,RoHS
2x PCIe
1x [NR](2x4 to 3 2x2), PH3.0,45cm,8.5A/p,18AWG,RoHS
4x 80x80x38 mm, 16.8K RPM, Middle Cooling Fan for 2U Hyper-S Se
1x Middle riser support bracket for CSE-HS219/HS29
2x Riser Bracket(2-slot) for RSC-H-68G5 for HE211/HS829/HS219,R
1x Riser Bracket(4-slot) for RSC-H2-6888G5L in CSE-HS219/HS829
3x 1U LHS Hyper Riser card with one PCI-E 5.0 X16 and one P
1x 1U LHS Hyper riser card with one PCI-E 5.0 X16 slot,HF,R
General Description
- Motherboard Super X13DEMProcessor CPUDual Socket E (LGA-4677)
- 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
- Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
- Core CountUp to 64C/128T; Up to 320MB Cache per CPU
- NoteSupports up to 350W TDP CPUs (Air Cooled)
- Supports up to 350W TDP CPUs (Liquid Cooled)
- GPU Max GPU CountUp to 4 double-width or 4 single-width GPU(s)
- Supported GPUNVIDIA PCIe: H100, L40S, A40, A100
- CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
- GPU-GPU InterconnectPCIe
- System Memory MemorySlot Count: 32 DIMM slots
- Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
- Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
- Memory Voltage1.1V
- On-Board Devices SATASATA (6Gbps) ; RAID 0/1/5/10 support
- NVMeNVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
- ChipsetIntel® C741
- Network connectivity via AIOM
- Input / Output LAN1 RJ45 1 GbE Dedicated BMC LAN port(s)
- USB2 USB 2.0 port(s) (rear)
- Video1 VGA port(s)
- System BIOSBIOS TypeAMI 256MB SPI Flash
- ManagementSoftware SuperCloud Composer
- Server Manager (SSM)
- Update Manager (SUM)
- SuperDoctor® 5
- Super Diagnostics Offline
- Power configurationsPower-on mode for AC power recovery
- ACPI Power Management
- SecurityHardwareTrusted Platform Module (TPM) 2.0
- Silicon Root of Trust (RoT) – NIST 800-193 Compliant
- FeaturesCryptographically Signed Firmware
- Secure Boot
- Secure Firmware Updates
- Automatic Firmware Recovery
- Supply Chain Security: Remote Attestation
- Runtime BMC Protections
- System Lockdown
- PC Health MonitoringCPUMonitors for CPU Cores, Chipset Voltages, Memory
- FANFans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
- TemperatureMonitoring for CPU and chassis environment
- Thermal Control for fan connectors
- ChassisForm Factor2U Rackmount
- ModelCSE-HS829-R1K24P
- Dimensions and WeightHeight3.5" (88.9 mm)
- Width17.2" (437 mm)
- Depth31.6" (803 mm)
- Package10.4" (H) x 23.8" (W) x 43.6" (D)
- WeightGross Weight: 63 lbs (28.6 kg)
- Net Weight: 37 lbs (16.8 kg)
- Available ColorN/A
- Front PanelLEDHDD activity
- LAN1 activity
- Power
- System information
- ButtonsPower On/Off
- UID button
- Expansion Slots PCI-Express (PCIe) ConfigurationOption A*
- 4 PCIe 5.0 x16 (in x16) FH/10.5"L double-width slot(s)
- 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
- Option B*
- 8 PCIe 5.0 x8 (in x16) HH/10.5"L slot(s)
- 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
- (*Requires additional parts.)
- M.22 M.2 NVMe/SATA slot(s) (B+M-key 2280/22110)
- Drive Bays / Storage Drive Bays ConfigurationDefault: Total 12 bay(s)
- 12 front hot-swap 3.5" NVMe*/SAS*/SATA* drive bay(s)
- (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
- M.22 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
- System CoolingFans4 counter-rotating 80x80x38mm Fan(s)
- Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
- Power Supply2x 1200W Redundant Titanium Level Hot-plug power suppliesDimension (WxHxL)73.5 x 40 x 265 mm
- +12VMax: 66.7A / Min: 0A (100Vac-127Vac)
- Max: 100A / Min: 0A (200Vac-240Vac)
- Max: 100A / Min: 0A (230Vdc-240Vdc) (for CCC only)
- 12V SBMax: 2.1A / Min: 0A
- AC Input800W: 100-127Vac / 50-60Hz
- 1200W: 200-240Vac / 50-60Hz
- 1200W: 230-240Vdc / 50-60Hz (for CCC only)
- Output TypeBackplanes (gold finger)
- Operating EnvironmentEnvironmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
- Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
- Operating Relative Humidity: 8% to 90% (non-condensing)
- Non-operating Relative Humidity: 5% to 95% (non-condensing)
- Environmental / RecyclingRecycle Return Server-End of Life Product
More products
High-load Application Server MP SuperServer BR-56RT-YU
45 360 EUR
Current server configuration:
1x X13QEH+, CSE-218H2TS-R2K7AWP
4x SPR 6448H 4/2P 32C 2.4G 250W (2.1/225, 1.9/205) 60M BI(1122)
4x 32GB DDR5 4800 ECC REG---MEM-DR532MD-ER48
8x PM9A3 1.9TB NVMe PCIe 4x4 2.5" 7mm (1DWPD) SED---HDS-25N4-
001T9-E1-TXD-SED-007
1x AIOM Dual-Port 10GbE SFP+, b/ on X710-BM2 with 0.5U Brack
1x NVIDIA PNY Quadro RTX A4000 16GB GDDR6 PCIe 4.0 Active
Cooling
1x AIOM 2-port 10GBase-T, Intel X550, RoHS
4x 2-Port PCIe Gen 5 U.2 NVMe SSD Storage Backplane
4x MCIO x8 (STR to STR),10CM,85OHM,RoHS
2x MicroHi(2x4 to 2x2Y),Ph3.0, 30/30cm,9.5A/p,16AWG,RoHS
8x Metallic black gen-3 hot-swap 2.5 NVMe tool-less tray, RoHS
4x SOCKET E E1B CARRIER LGA 4677 W/SHIM SPR MCC, DG1.0 ,RoHS
1x GPU card riser bracket set for SC218H, RoHS
2x Mylar rear CPU air shroud for X13QEH+ in SC218H2 with 1U HS
1x 1U Right EVAC CPU Heat Sink for SYS-241E-TNRTTP, RoHS
General Description
1x X13QEH+, CSE-218H2TS-R2K7AWP
4x SPR 6448H 4/2P 32C 2.4G 250W (2.1/225, 1.9/205) 60M BI(1122)
4x 32GB DDR5 4800 ECC REG---MEM-DR532MD-ER48
8x PM9A3 1.9TB NVMe PCIe 4x4 2.5" 7mm (1DWPD) SED---HDS-25N4-
001T9-E1-TXD-SED-007
1x AIOM Dual-Port 10GbE SFP+, b/ on X710-BM2 with 0.5U Brack
1x NVIDIA PNY Quadro RTX A4000 16GB GDDR6 PCIe 4.0 Active
Cooling
1x AIOM 2-port 10GBase-T, Intel X550, RoHS
4x 2-Port PCIe Gen 5 U.2 NVMe SSD Storage Backplane
4x MCIO x8 (STR to STR),10CM,85OHM,RoHS
2x MicroHi(2x4 to 2x2Y),Ph3.0, 30/30cm,9.5A/p,16AWG,RoHS
8x Metallic black gen-3 hot-swap 2.5 NVMe tool-less tray, RoHS
4x SOCKET E E1B CARRIER LGA 4677 W/SHIM SPR MCC, DG1.0 ,RoHS
1x GPU card riser bracket set for SC218H, RoHS
2x Mylar rear CPU air shroud for X13QEH+ in SC218H2 with 1U HS
1x 1U Right EVAC CPU Heat Sink for SYS-241E-TNRTTP, RoHS
General Description
- Motherboard Super X13QEH+ Processor CPU Quad Socket E (LGA-4677)
- 4th Gen Intel® Xeon® Scalable processors
- Core CountUp to 60C/120T; Up to 112.5MB Cache per CPU
- NoteSupports 165W - 350W TDP CPUs (Air Cooled)
- GPU Max GPU CountUp to 2 double-width GPU(s)
- Supported GPUNVIDIA PCIe: H100, L40, RTX A6000, RTX A4000, L40S, A100
- CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
- GPU-GPU InterconnectPCIe
- System Memory MemorySlot Count: 64 DIMM slots
- Max Memory (1DPC): Up to 8TB 4800MT/s ECC DDR5 RDIMM
- Max Memory (2DPC): Up to 16TB 4400MT/s ECC DDR5 RDIMM
- On-Board Devices ChipsetIntel® C741
- Network Connectivity Via AIOM
- NVMe
- Input / Output LAN1 RJ45 1 GbE Dedicated IPMI LAN port(s)
- USB2 USB 3.0 port(s) (rear)
- 2 USB 2.0 port(s) (front)
- Video1 VGA port(s)
- 1 DisplayPort port(s)
- Serial1 COM port(s) (Rear)
- System BIOSBIOS TypeAMI 32MB SPI Flash EEPROM
- ManagementSoftware SuperCloud Composer
- Supermicro Server Manager (SSM)
- Supermicro Update Manager (SUM)
- SuperDoctor® 5
- Super Diagnostics Offline
- Power configurationsPower-on mode for AC power recovery
- ACPI Power Management
- SecurityHardwareTrusted Platform Module (TPM) 2.0
- Silicon Root of Trust (RoT) – NIST 800-193 Compliant
- FeaturesCryptographically Signed Firmware
- Secure Boot
- Secure Firmware Updates
- Automatic Firmware Recovery
- Supply Chain Security: Remote Attestation
- Runtime BMC Protections
- System Lockdown
- PC Health MonitoringCPUMonitors for CPU Cores, Chipset Voltages, Memory
- 4+1 Phase-switching voltage regulator
- FAN Fans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
- Temperature Monitoring for CPU and chassis environment
- Thermal Control for fan connectors
- Chassis Form Factor2U Rackmount
- Model CSE-218H2TS-R2K7AWP
- Chassis WeightNet Weight: 45.5 lbs (20.64 kg)
- Gross Weight: 71.5 lbs (32.43 kg)
- Dimensions and WeightHeight3.5" (87.9 mm)
- Width 17.3" (438.4 mm)
- Depth 32" (812.9 mm)
- Package 9.75" (H) x 26.5" (W) x 43.5" (D)
- Weight Gross Weight: 71.5 lbs (32.43 kg)
- Net Weight: 45.5 lbs (20.64 kg)
- Available ColorBlack
- Front Panel LED HDD activity
- Network activity
- Power status
- System information (overheat/UID)
- ButtonsPower On/Off
- UID
- Expansion Slots PCI-Express (PCIe) Configuration Default
- 3 PCIe 5.0 x8 (in x16) FHHL slot(s)
- 3 PCIe 5.0 x16 FHHL slot(s)
- 1 PCIe 5.0 x8 AIOM slot(s) (OCP 3.0 compatible)
- 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
- Option A
- 2 PCIe 5.0 x16 FHFL double-width slot(s)
- 2 PCIe 5.0 x16 FHHL slot(s)
- 1 PCIe 5.0 x8 AIOM slot(s) (OCP 3.0 compatible)
- 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
- Option B*
- 3 PCIe 5.0 x8 (in x16) FHHL slot(s)
- 3 PCIe 5.0 x16 FHHL slot(s)
- 2 PCIe 4.0 x8 (in x16) LP slot(s)
- 2 PCIe 4.0 x16 LP slot(s)
- 1 PCIe 5.0 x8 AIOM slot(s) (OCP 3.0 compatible)
- 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
- Drive Bays / Storage Drive Bays ConfigurationDefault: Total 8 bay(s)
- 8 front hot-swap 2.5" SATA drive bay(s)
- Option A: Total 8 bay(s)
- 8 front hot-swap 2.5" PCIe 5.0 NVMe*/SAS*/SATA* drive bay(s)
- (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
- M.22 M.2 PCIe 3.0 x4 NVMe/SATA slot(s) (M-key 2280/22110)
- System Cooling Fans 2 Internal Heavy-duty counter-rotating 6cm Fan(s)
- 3 Heavy-duty counter-rotating 8cm Fan(s)
- Power Supply 2x 2700W Redundant (1 + 1) Titanium Level power supplies Dimension (WxHxL) 73.5 x 40 x 203 mm
- +12VMax: 225A / Min: 0A (200Vac-240Vac)
- Max: 225A / Min: 0A (240Vdc-240Vdc)
- 12V SBMax: 4A / Min: 0A
- AC Input 2700W: 200-240Vac / 50-60Hz
- 2700W: 240-240Vdc / 50-60Hz (for CQC only)
- Output TypeBackplanes (gold finger)
- Operating Environment ROHS RoHS Compliant
- Environmental Spec. Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
- Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
- Operating Relative Humidity: 8% to 90% (Non-Condensing)
- Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
Deep Learning
Training Server GPU TRE-90-80
Training Server GPU TRE-90-80
Price on request
Current server configuration:
General Description
General Description
- Motherboard Super X13DEG-OAProcessor CPUDual Socket E (LGA-4677)
- 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
- Core CountUp to 64C/128T; Up to 320MB Cache per CPU
- NoteSupports up to 350W TDP CPUs (Air Cooled)
- Supports up to 385W TDP CPUs (Liquid Cooled)
- GPU Max GPU CountUp to 8 double-width or 8 single-width GPU(s)
- Supported GPUNVIDIA PCIe: H100, RTX A4000, RTX 6000 ADA, L40S, A100
- CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
- GPU-GPU InterconnectNVIDIA® NVLink® Bridge (optional)
- System Memory MemorySlot Count: 32 DIMM slots
- Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
- Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
- Memory Voltage1.1V
- On-Board Devices ChipsetIntel® C741
- Network Connectivity2 RJ45 10GbE with Intel® X710-AT2
- NVMe
- Input / Output Video1 VGA port(s)
- System BIOSBIOS TypeAMI 32MB SPI Flash EEPROM
- ManagementSoftware SuperCloud Composer
- Server Manager (SSM)
- Update Manager (SUM)
- SuperDoctor® 5
- Super Diagnostics Offline
- Power configurationsPower-on mode for AC power recovery
- ACPI Power Management
- SecurityHardwareTrusted Platform Module (TPM) 2.0
- Silicon Root of Trust (RoT) – NIST 800-193 Compliant
- FeaturesCryptographically Signed Firmware
- Secure Boot
- Secure Firmware Updates
- Automatic Firmware Recovery
- Supply Chain Security: Remote Attestation
- Runtime BMC Protections
- System Lockdown
- PC Health MonitoringCPUMonitors for CPU Cores, Chipset Voltages, Memory
- 8+4 Phase-switching voltage regulator
- FANFans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
- TemperatureMonitoring for CPU and chassis environment
- Thermal Control for fan connectors
MicroBlade Server for CyberSecurity, Video, and Audio applications TY659
Price on request
Current server configuration:
General Description
General Description
- Switch ModuleMBM-XEM-002+Broadcom BCM56846 10GbE Low Latency Switch
- 2x 40G, 4x 10G, and 1x 1G uplinks
- 56x 10/1Gbps downlinks (MicroBlade)
- 1 Console port, 1 USB port
- Central Management Module (CMM)MBM-CMM-FIOCMM with Front IO support
- Processor (per node)CPUSingle Socket H5 (LGA 1200),
- CPU TDP support up to 95W
- Support Intel® Xeon® processor E-2300 series
- CoresUp to 8 cores, 16 threads
- System Memory (per node)Memory Capacity4 DDR4 DIMM sockets
- Supports up to 128GB DDR4 ECC VLP UDIMM
- Memory Type3200MHz ECC DDR4 UDIMM
- DIMM Sizes32GB
- Memory Voltage1.2 V
- Error DetectionCorrects single-bit errors
- Detects double-bit errors
- (using ECC memory)
- On-Board Devices (per node)ChipsetIntel® C256 chipset
- Network ControllersDual 10GbE LAN ports
- IPMISupport for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
- System BIOSBIOS Type128Mb Flash EEPROM
- BIOS FeaturesPlug and Play (PnP)
- APM 1.2
- SMBIOS 2.7.1
- DimensionsHeight 5.215" (132.5mm)
- Width17.67" (449mm)
- Depth36.10" (917mm)
- WeightGross Weight: 139.20 lbs (63.14 kg)
- Available ColorsSilver Grey
- Front PanelLEDsPower LED
- Fault LED
- Network Activity LED
- UID / KVM LED
- Drive Bays (per node)Internal2x 2.5" U.2 NVMe (7mm) drives
- M.2M.2 Interface: 1 PCI-E 3.0 x4
- M.2 Form Factor: 2280/22110
- M.2 Key: M-Key
- Others1x SATA DOM
- Input / OutputTPM1 TPM Header
- Operating Environment / ComplianceEnvironmental Spec.Operating Temperature:
- 10°C to 38°C (50°F to 100.4°F)
- Non-operating Temperature:
- -40°C to 70°C (-40°F to 158°F)
- Operating Relative Humidity:
- 8% to 90% (non-condensing)
- Non-operating Relative Humidity:
- 5% to 95% (non-condensing)
- Electromagnetic Compatibility (EMC)United States / CanadaFCC- Emissions (US) Verification
- EuropeEN55022 - Emissions
- EN55024 - Immunity
- EN61000-3-2 - Harmonics
- EN61000-3-3 - Voltage Flicker
- CE - EMC Directive 89/336/EEC
GPU Optimized ARM-based servers using the Ampere One ® CPU
120 921 EUR
Current server configuration:
1x ARS-221GL-NR MBD-G1SMH-P 2U ARM 4GPU GEN5 PCIE CSE-GP20
2x cron 7450 PRO 3.8TB NVMe PCIe 4.0 M.2 22x110mm 3D TLC, 1DWPD---HDS-M2N4-003T8-E1-TXD-NON-110
2x NVIDIA H100 NVL 94GB PCIe 5.0 x16 Passive Cooling (March 14, 2024 Initial release)
1x Mellanox CONNECTX-6 DX ETHERNET SMARTNIC 2x 25G
2x MCIO x8 (STR to STR),13cm,85OHM, RoHS
2x MCIO x8 (STR to STR),55CM,30AWG,RoHS
1x NVIDIA C2 - 480GB PG535- SKU200, Grace CPU Module
1x Standard Low-profile dual-port 10Gbase-T with NC-SI, Intel X550
General Description
1x ARS-221GL-NR MBD-G1SMH-P 2U ARM 4GPU GEN5 PCIE CSE-GP20
2x cron 7450 PRO 3.8TB NVMe PCIe 4.0 M.2 22x110mm 3D TLC, 1DWPD---HDS-M2N4-003T8-E1-TXD-NON-110
2x NVIDIA H100 NVL 94GB PCIe 5.0 x16 Passive Cooling (March 14, 2024 Initial release)
1x Mellanox CONNECTX-6 DX ETHERNET SMARTNIC 2x 25G
2x MCIO x8 (STR to STR),13cm,85OHM, RoHS
2x MCIO x8 (STR to STR),55CM,30AWG,RoHS
1x NVIDIA C2 - 480GB PG535- SKU200, Grace CPU Module
1x Standard Low-profile dual-port 10Gbase-T with NC-SI, Intel X550
General Description
- Motherboard Super G1SMH Processor CPU Dual processor(s)
- NVIDIA Dual 72-core CPUs on a Grace™ CPU Superchip
- NoteSupports up to 500W TDP CPUs (Air Cooled)
- GPU Max GPU CountUp to 4 double-width GPU(s)
- Supported GPU NVIDIA PCIe: H100 NVL, L40S
- CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
- GPU-GPU InterconnectNVIDIA® NVLink® Bridge (optional)
- System Memory MemorySlot Count: Onboard Memory
- Max Memory: Up to 480GB ECC LPDDR5X
- Memory Voltage1.1V
- On-Board Devices ChipsetNVIDIA C2
- Network Connectivity1 RJ45 1GbE
- IPMI Support for Intelligent Platform Management Interface v.2.0
- IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
- Input / Output Video1 mini-DP port(s)
- System BIOSBIOS TypeAMI 32MB SPI Flash EEPROM
- Management Software SuperDoctor® 5
- Watch Dog
- NMI
- SUM
- KVM with dedicated LAN
- SPM
- Intel® Node Manager
- SSM
- IPMI 2.0
- Redfish API
- OOB Management Package (SFT-OOB-LIC )
- Power configurations Power-on mode for AC power recovery
- ACPI Power Management
- PC Health Monitoring CPU Monitors for CPU Cores, Chipset Voltages, Memory
- FAN Fans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
- Temperature Monitoring for CPU and chassis environment
- Thermal Control for fan connectors
- Chassis Form Factor2U Rackmount
- Model CSE-GP201TS-R000NP
- Dimensions and WeightHeight3.46" (88 mm)
- Width17.25" (438.4 mm)
- Depth35.43" (900 mm)
- Package11" (H) x 22.5" (W) x 45.5" (D)
- Weight Gross Weight: 86.5 lbs (39.2 kg)
- Net Weight: 67.5 lbs (30.6 kg)
- Available ColorBlack front & silver body
- Front Panel LED Hard drive activity LED
- Network activity LEDs
- Power status LED
- System Overheat & Power Fail LED
- Buttons Power On/Off button
- System Reset button
- Expansion Slots PCI-Express (PCIe) Configuration Default
- 7 PCIe 5.0 x16 FHFL slot(s)
- Drive Bays / Storage Drive Bays ConfigurationDefault: Total 8 bay(s)
- 8 front hot-swap E1.S NVMe drive bay(s)
- M.2
- System Cooling Fans 6 heavy-duty fans with optimal fan speed control
- Power Supply 2000W Redundant Titanium Level power supplies Dimension (WxHxL)73.5 x 40 x 185 mm
- +12VMax: 83A / Min: 0A (100Vac-127Vac)
- Max: 150A / Min: 0A (200Vac-220Vac)
- Max: 165A / Min: 0A (220Vac-230Vac)
- Max: 166A / Min: 0A (230Vac-240Vac)
- 12V SBMax: 3.5A / Min: 0A
- AC Input1000W: 100-127Vac / 50-60Hz
- 1800W: 200-220Vac / 50-60Hz
- 1980W: 220-230Vac / 50-60Hz
- 2000W: 220-240Vac / 50-60Hz (for UL only)
- 2000W: 230-240Vac / 50-60Hz
- 2000W: 230-240Vdc / 50-60Hz (for CQC only)
- Output Type Backplanes (gold finger)
- Operating Environment Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
- Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
- Operating Relative Humidity: 8% to 90% (non-condensing)
- Non-operating Relative Humidity: 5% to 95% (non-condensing)
Our company has extensive experience working with startups and enterprise clients. Based on the analysis of the tasks of our clients, we have formed a new business case that we want to offer today to our clients in Europe. Analysis of the activities of numerous startups and international companies allowed us to formulate three solutions that satisfy the needs of our clients by more than 90%. We have selected for you the most optimal server configurations that can be used by companies of any level or type of activity.
Our main business solution is to offer our customers ready-to-ship servers with minimal delivery time. By ordering our server, you can subsequently submit a request for additional components (RAM, hard drives, additional controllers, etc.).
Our main goal is to allow our clients to receive a ready-to-use solution in the shortest possible time and be able to expand it after work has begun. This allows our customers to ensure business continuity or quickly solve their problems in the shortest possible time. We ship tested servers to the client's address directly from the manufacturer's plant and coordinate with clients the supply of the necessary additional components to order, which allows us to provide our clients with the best price and at the same time provide the fastest delivery of equipment.
All servers are ready for shipment. Delivery time in the European Union countries is 3-7 working days. The price includes VAT.
Our main business solution is to offer our customers ready-to-ship servers with minimal delivery time. By ordering our server, you can subsequently submit a request for additional components (RAM, hard drives, additional controllers, etc.).
Our main goal is to allow our clients to receive a ready-to-use solution in the shortest possible time and be able to expand it after work has begun. This allows our customers to ensure business continuity or quickly solve their problems in the shortest possible time. We ship tested servers to the client's address directly from the manufacturer's plant and coordinate with clients the supply of the necessary additional components to order, which allows us to provide our clients with the best price and at the same time provide the fastest delivery of equipment.
All servers are ready for shipment. Delivery time in the European Union countries is 3-7 working days. The price includes VAT.
You can also order additional server components and upgrade your existing server configuration. Please bookmark this page for quick access.
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Aething Inc.
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Aething Inc.
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Patent Application No. P2020 30,284.
US patent Pub. No.: US 2021/0312491 A1
Sketches by Shari Blaukopf are used on the site. You may find paintings there.
US patent Pub. No.: US 2021/0312491 A1
Sketches by Shari Blaukopf are used on the site. You may find paintings there.